TJA1029TK/20/1J
vs
TJA1043TK/1Y
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SON
SON
Package Description
3 X 3 MM, 0.85 MM HEIGHT, GREEN, PLASTIC, SOT782-1, MO-229, HVSON-8
3 X 4.50 MM, 0.85 MM HEIGHT,GREEN, PLASTIC, MO-229, SOT1086-2, HVSON-14
Pin Count
8
14
Manufacturer Package Code
SOT782-1
SOT1086-2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
10 Weeks
10 Weeks
Samacsys Manufacturer
NXP
NXP
JESD-30 Code
S-PDSO-G8
R-PDSO-G14
JESD-609 Code
e4
e4
Length
3 mm
4.5 mm
Moisture Sensitivity Level
1
3
Number of Functions
1
1
Number of Terminals
8
14
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSSOP
HVSSOP
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Screening Level
AEC-Q100
AEC-Q100
Seated Height-Max
1 mm
1 mm
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Telecom IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
Terminal Finish
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
3 mm
3 mm
Base Number Matches
1
1
Compare TJA1029TK/20/1J with alternatives
Compare TJA1043TK/1Y with alternatives