TDA1170N
vs
KA2135
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
QIP
|
SIP
|
| Package Description |
PLASTIC, QIP-12
|
SIP, SIP12,.1
|
| Pin Count |
12
|
12
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Application |
TV; MONITOR
|
TV; MONITOR
|
| Blanking Output |
NO
|
NO
|
| Consumer IC Type |
VERTICAL DEFLECTION IC
|
HORIZONTAL DEFLECTION IC
|
| JESD-30 Code |
R-PQIP-T12
|
R-PSIP-T12
|
| JESD-609 Code |
e0
|
e0
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
12
|
12
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QIP
|
SIP
|
| Package Equivalence Code |
QI16B,.2/.4,100TB
|
SIP12,.1
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
35 V
|
12.1 V
|
| Supply Voltage-Min (Vsup) |
10 V
|
9.9 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
SINGLE
|
| Base Number Matches |
1
|
1
|
| Length |
|
29.4 mm
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
-20 °C
|
| Seated Height-Max |
|
9.5 mm
|
| Temperature Grade |
|
COMMERCIAL
|
| Width |
|
3.85 mm
|
|
|
|
Compare TDA1170N with alternatives
Compare KA2135 with alternatives