SY87739LHI
vs
SY87739LHY
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICREL INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QFP
|
|
Package Description |
HTQFP, TQFP32,.35SQ,32
|
7 X 7 MM, LEAD FREE, TQFP-32
|
Pin Count |
32
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Applications |
ATM; SDH; SONET
|
ATM; SDH; SONET
|
JESD-30 Code |
S-PQFP-G32
|
S-PQFP-G32
|
JESD-609 Code |
e0
|
e3
|
Length |
7 mm
|
7 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTQFP
|
HTQFP
|
Package Equivalence Code |
TQFP32,.35SQ,32
|
TQFP32,.35SQ,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE
|
Peak Reflow Temperature (Cel) |
240
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Current-Max |
0.28 mA
|
280 mA
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ATM/SONET/SDH SUPPORT CIRCUIT
|
ATM/SONET/SDH SUPPORT CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn85Pb15)
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
7 mm
|
7 mm
|
Base Number Matches |
2
|
3
|
ECCN Code |
|
EAR99
|
Factory Lead Time |
|
4 Weeks
|
Samacsys Manufacturer |
|
Microchip
|
|
|
|
Compare SY87739LHI with alternatives
Compare SY87739LHY with alternatives