ST13003DN vs BUW84 feature comparison

ST13003DN STMicroelectronics

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BUW84 NXP Semiconductors

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS NXP SEMICONDUCTORS
Part Package Code SIP
Package Description ROHS COMPLIANT PACKAGE-3 IN-LINE, R-PSIP-T3
Pin Count 3 3
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
Samacsys Manufacturer STMicroelectronics
Collector Current-Max (IC) 1 A 2 A
Collector-Emitter Voltage-Max 400 V 400 V
Configuration SINGLE WITH BUILT-IN DIODE SINGLE
DC Current Gain-Min (hFE) 5 15
JEDEC-95 Code TO-126
JESD-30 Code R-PSFM-T3 R-PSIP-T3
JESD-609 Code e3
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT IN-LINE
Polarity/Channel Type NPN NPN
Power Dissipation-Max (Abs) 20 W 50 W
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 1 3
HTS Code 8541.29.00.95
Case Connection COLLECTOR
Power Dissipation Ambient-Max 50 W
Transition Frequency-Nom (fT) 20 MHz
Turn-on Time-Max (ton) 500 ns
VCEsat-Max 1 V

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