SPAK68882RC16A
vs
TS68882MF8B/Y25
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
THOMSON-CSF SEMICONDUCTORS
Package Description
PGA,
,
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
5
Boundary Scan
NO
Bus Compatibility
MC68020; MC68030
Clock Frequency-Max
16 MHz
External Data Bus Width
32
JESD-30 Code
S-CPGA-P68
S-CQFP-G68
Length
26.92 mm
Number of Terminals
68
68
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.59 mm
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
HCMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
PIN/PEG
GULL WING
Terminal Pitch
2.54 mm
Terminal Position
PERPENDICULAR
QUAD
Width
26.92 mm
uPs/uCs/Peripheral ICs Type
MATH PROCESSOR, COPROCESSOR
MATH PROCESSOR, COPROCESSOR
Base Number Matches
2
3
Part Package Code
QFP
Pin Count
68
ECCN Code
3A001.A.2.C
Screening Level
CECC90000B
Compare SPAK68882RC16A with alternatives
Compare TS68882MF8B/Y25 with alternatives