SN54HC00TDF2
vs
HD74HC00T-EL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
RENESAS ELECTRONICS CORP
Package Description
DIE-14
TSSOP,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-XUUC-N14
R-PDSO-G14
Length
1.2553 mm
5 mm
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.004 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TUBE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
1.0903 mm
4.4 mm
Base Number Matches
1
2
Part Package Code
SOIC
Pin Count
14
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Propagation Delay (tpd)
115 ns
Qualification Status
Not Qualified
Seated Height-Max
1.1 mm
Supply Voltage-Nom (Vsup)
4.5 V
Temperature Grade
INDUSTRIAL
Terminal Pitch
0.65 mm
Compare SN54HC00TDF2 with alternatives
Compare HD74HC00T-EL with alternatives