SN54HC00TDF2
vs
74HC00PW,112
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NXP SEMICONDUCTORS
Package Description
DIE-14
4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-XUUC-N14
R-PDSO-G14
Length
1.2553 mm
5 mm
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.004 A
0.004 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TUBE
TUBE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
1.0903 mm
4.4 mm
Base Number Matches
1
2
Part Package Code
TSSOP
Pin Count
14
Manufacturer Package Code
SOT402-1
Factory Lead Time
4 Weeks
JESD-609 Code
e4
Load Capacitance (CL)
50 pF
Moisture Sensitivity Level
1
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Package Equivalence Code
TSSOP14,.25
Prop. Delay@Nom-Sup
27 ns
Propagation Delay (tpd)
135 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
1.1 mm
Supply Voltage-Nom (Vsup)
5 V
Temperature Grade
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch
0.65 mm
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