SN54HC00TDF2
vs
74HC00DB-T
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
| Package Description |
DIE-14
|
SSOP,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-XUUC-N14
|
R-PDSO-G14
|
| Length |
1.2553 mm
|
6.2 mm
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Max I(ol) |
0.004 A
|
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
SSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
SMALL OUTLINE, SHRINK PITCH
|
| Packing Method |
TUBE
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
UPPER
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
1.0903 mm
|
5.3 mm
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
SSOP
|
| Pin Count |
|
14
|
| JESD-609 Code |
|
e4
|
| Load Capacitance (CL) |
|
50 pF
|
| Moisture Sensitivity Level |
|
1
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Propagation Delay (tpd) |
|
135 ns
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
2 mm
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Pitch |
|
0.65 mm
|
|
|
|
Compare SN54HC00TDF2 with alternatives
Compare 74HC00DB-T with alternatives