SA58641DK
vs
SA58641DK,112
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SSOP
SSOP2
Package Description
LSSOP,
LSSOP,
Pin Count
20
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e4
e4
Length
6.5 mm
6.5 mm
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSSOP
LSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1.5 mm
Supply Current-Max
8.5 mA
8.5 mA
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Telecom IC Type
CORDLESS TELEPHONE SUPPORT CIRCUIT
CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
4.4 mm
4.4 mm
Base Number Matches
3
1
Manufacturer Package Code
SOT266-1
Compare SA58641DK with alternatives
Compare SA58641DK,112 with alternatives