SA58641DK
vs
U2763B-AFN
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
TELEFUNKEN MICROELECTRONICS GMBH
|
| Package Description |
SSOP20,.25
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Mounting Feature |
SURFACE MOUNT
|
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
SSOP20,.25
|
SSOP20,.25
|
| Power Supplies |
5 V
|
|
| Supply Current-Max |
8.5 mA
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Base Number Matches |
2
|
3
|
| HTS Code |
|
8542.39.00.01
|
| JESD-30 Code |
|
R-PDSO-G20
|
| JESD-609 Code |
|
e0
|
| Package Code |
|
SSOP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, SHRINK PITCH
|
| Qualification Status |
|
Not Qualified
|
| Supply Voltage-Nom |
|
3 V
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.635 mm
|
| Terminal Position |
|
DUAL
|
|
|
|