S8273W vs AM2804XX feature comparison

S8273W NXP Semiconductors

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AM2804XX AMD

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP ADVANCED MICRO DEVICES INC
Package Description , DIE,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Count Direction RIGHT RIGHT
Family 82 AM28
JESD-30 Code R-CDFP-F16 R-XUUC-N12
Logic IC Type SERIAL IN PARALLEL OUT SERIAL IN SERIAL OUT
Number of Bits 10 1024
Number of Functions 1 1
Number of Terminals 16 12
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
Package Code DFP DIE
Package Equivalence Code FL16,.3 DIE OR CHIP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK UNCASED CHIP
Power Supply Current-Max (ICC) 103 mA
Propagation Delay (tpd) 40 ns 90 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL
Temperature Grade MILITARY
Terminal Form FLAT NO LEAD
Terminal Position DUAL UPPER
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 35 MHz 5 MHz
Base Number Matches 3 1
Part Package Code DIE
Pin Count 12
Output Characteristics OPEN-DRAIN

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