PCA9517AD,118
vs
PCA9517ADP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SOIC
SOIC
Package Description
3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8
3 MM, PLASTIC, SOT505-1, TSSOP-8
Pin Count
8
8
Manufacturer Package Code
SOT96-1
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
16 Weeks
11 Weeks, 1 Day
Samacsys Manufacturer
NXP
NXP
Interface IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
JESD-30 Code
R-PDSO-G8
S-PDSO-G8
JESD-609 Code
e4
e4
Length
4.9 mm
3 mm
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSSOP
Package Equivalence Code
SOP8,.25
TSSOP8,.19
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.1 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
0.9 V
0.9 V
Supply Voltage-Nom
1.2 V
1.2 V
Supply Voltage1-Max
5.5 V
5.5 V
Supply Voltage1-Min
2.7 V
2.7 V
Supply Voltage1-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
3.9 mm
3 mm
Base Number Matches
1
1
Pbfree Code
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