P89C668HBBD/00,557 vs SST89E554RC-40-C-TQJ feature comparison

P89C668HBBD/00,557 NXP Semiconductors

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SST89E554RC-40-C-TQJ Silicon Storage Technology

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS SILICON STORAGE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-389-1, LQFP-44 TQFP, TQFP44,.47SQ,32
Pin Count 44 44
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width 16 16
Bit Size 8 8
CPU Family 8051 8051
Clock Frequency-Max 33 MHz 40 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code S-PQFP-G44 S-PQFP-G44
JESD-609 Code e3
Length 10 mm 10 mm
Number of I/O Lines 32 32
Number of Terminals 44 44
On Chip Program ROM Width 8 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP TQFP
Package Equivalence Code QFP44,.47SQ,32 TQFP44,.47SQ,32
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, THIN PROFILE
Qualification Status Not Qualified Not Qualified
RAM (bytes) 8192 1024
ROM (words) 65536 32768
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.2 mm
Speed 33 MHz 40 MHz
Supply Current-Max 64 mA 88 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 5 V 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Width 10 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare P89C668HBBD/00,557 with alternatives

Compare SST89E554RC-40-C-TQJ with alternatives