SST89E554RC-40-C-TQJ
vs
P89C51RB2HBP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SILICON STORAGE TECHNOLOGY INC
PHILIPS SEMICONDUCTORS
Part Package Code
QFP
Package Description
TQFP, TQFP44,.47SQ,32
DIP, DIP40,.6
Pin Count
44
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
Address Bus Width
16
Bit Size
8
8
CPU Family
8051
8051
Clock Frequency-Max
40 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
8
JESD-30 Code
S-PQFP-G44
R-PDIP-T40
Length
10 mm
Number of I/O Lines
32
Number of Terminals
44
40
On Chip Program ROM Width
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TQFP
DIP
Package Equivalence Code
TQFP44,.47SQ,32
DIP40,.6
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK, THIN PROFILE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
1024
512
ROM (words)
32768
16384
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.2 mm
Speed
40 MHz
33 MHz
Supply Current-Max
88 mA
56 mA
Supply Voltage-Max
5.5 V
Supply Voltage-Min
5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.8 mm
2.54 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Base Number Matches
2
2
JESD-609 Code
e0
Terminal Finish
Tin/Lead (Sn/Pb)
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