NX25P16-VFI vs MX23L1654MC-20G feature comparison

NX25P16-VFI Winbond Electronics Corp

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MX23L1654MC-20G Macronix International Co Ltd

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Active End Of Life
Ihs Manufacturer WINBOND ELECTRONICS CORP MACRONIX INTERNATIONAL CO LTD
Part Package Code SOIC SOIC
Package Description 0.300 INCH, SOIC-16 SOP, SOP16,.4
Pin Count 16 16
Reach Compliance Code compliant unknown
Clock Frequency-Max (fCLK) 25 MHz 50 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e3
Length 10.285 mm 10.3 mm
Memory Density 16777216 bit 262144 bit
Memory IC Type FLASH MASK ROM
Memory Width 1 8
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 16777216 words 2097152 words
Number of Words Code 16000000 2000000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 16MX1 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.4 SOP16,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL PARALLEL
Peak Reflow Temperature (Cel) 240
Power Supplies 3/3.3 V
Programming Voltage 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.64 mm 2.65 mm
Serial Bus Type SPI
Standby Current-Max 0.000005 A 0.00005 A
Supply Current-Max 0.02 mA 0.008 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 4.5 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE
Width 7.49 mm 7.52 mm
Write Protection HARDWARE/SOFTWARE
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 200 ns
Moisture Sensitivity Level 3

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