NX25P16-VFI
vs
MX23L1654MC-20G
feature comparison
| Part Life Cycle Code |
Transferred
|
End Of Life
|
| Ihs Manufacturer |
NEXFLASH TECHNOLOGIES INC
|
MACRONIX INTERNATIONAL CO LTD
|
| Package Description |
,
|
SOP, SOP16,.4
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.71
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
16
|
| Access Time-Max |
|
200 ns
|
| Clock Frequency-Max (fCLK) |
|
50 MHz
|
| JESD-30 Code |
|
R-PDSO-G16
|
| JESD-609 Code |
|
e3
|
| Length |
|
10.3 mm
|
| Memory Density |
|
262144 bit
|
| Memory IC Type |
|
MASK ROM
|
| Memory Width |
|
8
|
| Moisture Sensitivity Level |
|
3
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
16
|
| Number of Words |
|
2097152 words
|
| Number of Words Code |
|
2000000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
32KX8
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
SOP
|
| Package Equivalence Code |
|
SOP16,.4
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Parallel/Serial |
|
PARALLEL
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
2.65 mm
|
| Standby Current-Max |
|
0.00005 A
|
| Supply Current-Max |
|
0.008 mA
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
7.52 mm
|
|
|
|
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