NX25P16-VFI vs S25FL016A0LMAI000 feature comparison

NX25P16-VFI Winbond Electronics Corp

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S25FL016A0LMAI000 Spansion

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP SPANSION INC
Part Package Code SOIC SOIC
Package Description 0.300 INCH, SOIC-16 SOP, SOP16,.4
Pin Count 16 16
Reach Compliance Code compliant compliant
Clock Frequency-Max (fCLK) 25 MHz 50 MHz
Data Retention Time-Min 20 20
Endurance 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0
Length 10.285 mm 10.3 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 1 8
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 16777216 words 2097152 words
Number of Words Code 16000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16MX1 2MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.4 SOP16,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 240
Power Supplies 3/3.3 V
Programming Voltage 2.7 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.64 mm 2.65 mm
Serial Bus Type SPI SPI
Standby Current-Max 0.000005 A 0.000005 A
Supply Current-Max 0.02 mA 0.028 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE NOR TYPE
Width 7.49 mm 7.5 mm
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8542.32.00.51
Output Characteristics 3-STATE

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