NVT2002DP
vs
GTL2002GM
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOIC
|
QFN
|
Package Description |
TSSOP,
|
VQCCN,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
NXP
|
NXP
|
Base Number Matches |
1
|
1
|
Additional Feature |
|
Also required VDREF 0 to 5.5V
|
Interface IC Type |
|
INTERFACE CIRCUIT
|
JESD-30 Code |
|
S-PQCC-N8
|
JESD-609 Code |
|
e4
|
Length |
|
1.6 mm
|
Moisture Sensitivity Level |
|
1
|
Number of Functions |
|
1
|
Number of Terminals |
|
8
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
HVQCCN
|
Package Equivalence Code |
|
LCC8,.06SQ,20
|
Package Shape |
|
SQUARE
|
Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
0.5 mm
|
Supply Voltage-Max |
|
5.5 V
|
Supply Voltage-Min |
|
|
Supply Voltage1-Max |
|
5.5 V
|
Supply Voltage1-Min |
|
|
Surface Mount |
|
YES
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
|
NO LEAD
|
Terminal Pitch |
|
0.5 mm
|
Terminal Position |
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
1.6 mm
|
|
|
|
Compare NVT2002DP with alternatives
Compare GTL2002GM with alternatives