NVT2002DP
vs
GTL2002D-T
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
TSSOP,
|
SOP-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
NXP
|
|
Additional Feature |
Also Required Vref(B) Supply 1.8 to 5.5V
|
Also required VDREF 0 to 5.5V
|
Delay-Max |
1.5 ns
|
|
Input Characteristics |
STANDARD
|
|
Interface IC Type |
VOLTAGE LEVEL TRANSLATOR
|
INTERFACE CIRCUIT
|
JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e4
|
e4
|
Length |
3 mm
|
4.9 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
2
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
105 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Latch or Register |
NONE
|
|
Output Polarity |
TRUE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
SOP
|
Package Equivalence Code |
TSSOP8,.19
|
SOP8,.25
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Seated Height-Max |
1.1 mm
|
1.75 mm
|
Supply Voltage-Max |
3.6 V
|
5.5 V
|
Supply Voltage-Min |
1 V
|
|
Supply Voltage-Nom |
1.2 V
|
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
3 mm
|
3.9 mm
|
Base Number Matches |
1
|
1
|
Qualification Status |
|
Not Qualified
|
Supply Voltage1-Max |
|
5.5 V
|
Supply Voltage1-Min |
|
|
|
|
|
Compare NVT2002DP with alternatives
Compare GTL2002D-T with alternatives