NLVX2G16AMUTCG
vs
74LVC2G07GW-Q100/CU
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ONSEMI
|
NEXPERIA
|
| Part Package Code |
DFN
|
|
| Package Description |
UDFN-6
|
,
|
| Pin Count |
6
|
|
| Manufacturer Package Code |
517AQ
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
2 Days
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Family |
2G
|
|
| JESD-30 Code |
R-PDSO-N6
|
|
| JESD-609 Code |
e4
|
e3
|
| Length |
1.45 mm
|
|
| Load Capacitance (CL) |
15 pF
|
|
| Logic IC Type |
BUFFER
|
BUFFER
|
| Max I(ol) |
0.004 A
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
2
|
|
| Number of Inputs |
1
|
|
| Number of Terminals |
6
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
VSON
|
|
| Package Equivalence Code |
SOLCC6,.04,20
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Prop. Delay@Nom-Sup |
10.2 ns
|
|
| Propagation Delay (tpd) |
10.2 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Schmitt Trigger |
NO
|
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Seated Height-Max |
0.55 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1 mm
|
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
|
|
|
Compare NLVX2G16AMUTCG with alternatives
Compare 74LVC2G07GW-Q100/CU with alternatives