74LVC2G07GW-Q100/CU
vs
74LVC2G07GW,132
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
NEXPERIA
|
NEXPERIA
|
Package Description |
,
|
TSSOP,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-609 Code |
e3
|
e3
|
Logic IC Type |
BUFFER
|
BUFFER
|
Moisture Sensitivity Level |
1
|
1
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Screening Level |
AEC-Q100
|
|
Terminal Finish |
TIN
|
TIN
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
1
|
1
|
Family |
|
LVC/LCX/Z
|
JESD-30 Code |
|
R-PDSO-G6
|
Length |
|
2 mm
|
Number of Functions |
|
2
|
Number of Inputs |
|
1
|
Number of Terminals |
|
6
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Characteristics |
|
OPEN-DRAIN
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
TSSOP
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Propagation Delay (tpd) |
|
8.4 ns
|
Seated Height-Max |
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
|
1.8 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
AUTOMOTIVE
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.65 mm
|
Terminal Position |
|
DUAL
|
Width |
|
1.25 mm
|
|
|
|
Compare 74LVC2G07GW-Q100/CU with alternatives
Compare 74LVC2G07GW,132 with alternatives
-
74LVC2G07GW,132 vs SN74LVC2G17DCKRG4
-
74LVC2G07GW,132 vs SN74LVC2G07DCKRE4
-
74LVC2G07GW,132 vs SN74LVC2G17QDCKRQ1
-
74LVC2G07GW,132 vs 74LVC2G17GW
-
74LVC2G07GW,132 vs 935301512125
-
74LVC2G07GW,132 vs SN74LVC2G07DCKTG4
-
74LVC2G07GW,132 vs SN74LVC2G17MDCKREP
-
74LVC2G07GW,132 vs 74LVC2G07GW-Q100,125
-
74LVC2G07GW,132 vs NL27WZ07DFT2G