74LVC2G07GW-Q100/CU
vs
SN74LVC2G07MDCKTEP
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NEXPERIA
|
TEXAS INSTRUMENTS INC
|
| Package Description |
,
|
TSSOP, TSSOP6,.08
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-609 Code |
e3
|
e4
|
| Logic IC Type |
BUFFER
|
BUFFER
|
| Moisture Sensitivity Level |
1
|
1
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Screening Level |
AEC-Q100
|
|
| Terminal Finish |
TIN
|
NICKEL PALLADIUM GOLD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
6
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Family |
|
LVC/LCX/Z
|
| JESD-30 Code |
|
R-PDSO-G6
|
| Length |
|
2 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.032 A
|
| Number of Functions |
|
2
|
| Number of Inputs |
|
1
|
| Number of Terminals |
|
6
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
|
OPEN-DRAIN
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP6,.08
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
|
TR
|
| Power Supply Current-Max (ICC) |
|
0.01 mA
|
| Prop. Delay@Nom-Sup |
|
5.7 ns
|
| Propagation Delay (tpd) |
|
5.7 ns
|
| Qualification Status |
|
Not Qualified
|
| Schmitt Trigger |
|
NO
|
| Seated Height-Max |
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
|
1.8 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
MILITARY
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
1.25 mm
|
|
|
|
Compare 74LVC2G07GW-Q100/CU with alternatives
Compare SN74LVC2G07MDCKTEP with alternatives