MT49H32M18CBM-18:A
vs
GS4576C18GL-24
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
End Of Life
Ihs Manufacturer
MICRON TECHNOLOGY INC
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
LEAD FREE, UBGA-144
TFBGA,
Pin Count
144
144
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Access Time-Max
15 ns
Additional Feature
AUTO REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
533 MHz
I/O Type
SEPARATE
Interleaved Burst Length
2,4,8
JESD-30 Code
R-PBGA-B144
R-PBGA-B144
JESD-609 Code
e1
Length
18.5 mm
18.5 mm
Memory Density
603979776 bit
603979776 bit
Memory IC Type
DDR DRAM
DDR DRAM
Memory Width
18
18
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
95 °C
70 °C
Operating Temperature-Min
Organization
32MX18
32MX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
TFBGA
Package Equivalence Code
BGA144,12X18,40/32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Sequential Burst Length
2,4,8
Standby Current-Max
0.055 A
Supply Current-Max
1.335 mA
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
11 mm
11 mm
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Self Refresh
YES
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MT49H32M18CBM-18:A with alternatives
Compare GS4576C18GL-24 with alternatives