MR27V1641L-XXXMPZ03A
vs
NX25P16-VFI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
LAPIS SEMICONDUCTOR CO LTD
WINBOND ELECTRONICS CORP
Part Package Code
SOIC
SOIC
Package Description
SOP,
0.300 INCH, SOIC-16
Pin Count
16
16
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
150 ns
Clock Frequency-Max (fCLK)
30 MHz
25 MHz
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e6
e0
Length
10.3 mm
10.285 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
MASK ROM
FLASH
Memory Width
16
1
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1MX16
16MX1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
2.64 mm
Supply Current-Max
0.02 mA
0.02 mA
Supply Voltage-Max (Vsup)
3.3 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN BISMUTH
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.5 mm
7.49 mm
Base Number Matches
1
7
Pbfree Code
Rohs Code
Category CO2 Kg
12
Data Retention Time-Min
20
Endurance
100000 Write/Erase Cycles
Package Equivalence Code
SOP16,.4
Peak Reflow Temperature (Cel)
240
Power Supplies
3/3.3 V
Programming Voltage
2.7 V
Serial Bus Type
SPI
Standby Current-Max
0.000005 A
Time@Peak Reflow Temperature-Max (s)
30
Type
NOR TYPE
Write Protection
HARDWARE/SOFTWARE
Compare MR27V1641L-XXXMPZ03A with alternatives
Compare NX25P16-VFI with alternatives