MR27V1641L-XXXMPZ03A
vs
MR27V1641L-XXXMPZ03D
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
OKI ELECTRIC INDUSTRY CO LTD
LAPIS SEMICONDUCTOR CO LTD
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP,
Pin Count
16
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Clock Frequency-Max (fCLK)
30 MHz
30 MHz
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e6
e6
Length
10.3 mm
10.3 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
MASK ROM
MASK ROM
Memory Width
1
16
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
16MX1
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
SERIAL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
2.65 mm
Supply Voltage-Max (Vsup)
3.6 V
3.3 V
Supply Voltage-Min (Vsup)
3 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN BISMUTH
TIN BISMUTH
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.5 mm
7.5 mm
Base Number Matches
2
2
Access Time-Max
150 ns
Supply Current-Max
0.02 mA
Compare MR27V1641L-XXXMPZ03A with alternatives
Compare MR27V1641L-XXXMPZ03D with alternatives