MR27V1641L-XXXMPZ03A vs MR27V1641L-XXXMPZ03D feature comparison

MR27V1641L-XXXMPZ03A LAPIS Semiconductor Co Ltd

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MR27V1641L-XXXMPZ03D LAPIS Semiconductor Co Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LAPIS SEMICONDUCTOR CO LTD LAPIS SEMICONDUCTOR CO LTD
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 150 ns 150 ns
Clock Frequency-Max (fCLK) 30 MHz 30 MHz
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e6 e6
Length 10.3 mm 10.3 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.65 mm
Supply Current-Max 0.02 mA 0.02 mA
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN BISMUTH TIN BISMUTH
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.5 mm 7.5 mm
Base Number Matches 2 2

Compare MR27V1641L-XXXMPZ03A with alternatives

Compare MR27V1641L-XXXMPZ03D with alternatives