MPC555LFAVR40
vs
MPC555LFAZP40
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272
|
BGA,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Date Of Intro |
1997-09-16
|
1997-09-16
|
Samacsys Manufacturer |
NXP
|
NXP
|
Has ADC |
YES
|
YES
|
Additional Feature |
ALSO REQUIRES 5V SUPPLY
|
ALSO REQUIRES 5V SUPPLY
|
Address Bus Width |
24
|
24
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
CPU Family |
MPC500
|
MPC500
|
Clock Frequency-Max |
20 MHz
|
20 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
32
|
32
|
Format |
FLOATING POINT
|
FLOATING POINT
|
JESD-30 Code |
S-PBGA-B272
|
S-PBGA-B272
|
JESD-609 Code |
e1
|
e0
|
Length |
27 mm
|
27 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
3
|
Number of DMA Channels |
|
|
Number of I/O Lines |
101
|
101
|
Number of Serial I/Os |
4
|
4
|
Number of Terminals |
272
|
272
|
Number of Timers |
3
|
3
|
On Chip Data RAM Width |
8
|
8
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA272,20X20,50
|
BGA272,20X20,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
235
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
26624
|
26624
|
ROM (words) |
458752
|
458752
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
2.65 mm
|
2.65 mm
|
Speed |
40 MHz
|
40 MHz
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
HCMOS
|
HCMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
Width |
27 mm
|
27 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MPC555LFAVR40 with alternatives
Compare MPC555LFAZP40 with alternatives