MPC555LFAZP40
vs
MPC566MZP40R2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
BGA
Package Description
BGA,
BGA, BGA388,22X22,40
Pin Count
272
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.31.00.01
Has ADC
YES
Additional Feature
ALSO REQUIRES 5V SUPPLY
Address Bus Width
24
Bit Size
32
32
Boundary Scan
YES
CPU Family
MPC500
Clock Frequency-Max
20 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
32
Format
FLOATING POINT
JESD-30 Code
S-PBGA-B272
S-PBGA-B388
Length
27 mm
Low Power Mode
YES
Number of DMA Channels
Number of I/O Lines
101
Number of Serial I/Os
4
Number of Terminals
272
388
Number of Timers
3
On Chip Data RAM Width
8
On Chip Program ROM Width
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA272,20X20,50
BGA388,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
26624
36864
ROM (words)
458752
1048576
ROM Programmability
FLASH
FLASH
Seated Height-Max
2.65 mm
Speed
40 MHz
40 MHz
Supply Voltage-Max
3.6 V
Supply Voltage-Min
3 V
Supply Voltage-Nom
3.3 V
Surface Mount
YES
YES
Technology
HCMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Base Number Matches
6
3
Rohs Code
Power Supplies
2.6,5 V
Supply Current-Max
120 mA
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