MPC555LFAZP40
vs
MPC555LFCVR40
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
ROCHESTER ELECTRONICS INC
|
| Package Description |
BGA,
|
BGA,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.31.00.01
|
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
ALSO REQUIRES 5V SUPPLY
|
|
| Address Bus Width |
24
|
24
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
|
| CPU Family |
MPC500
|
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
|
| JESD-30 Code |
S-PBGA-B272
|
S-PBGA-B272
|
| Length |
27 mm
|
27 mm
|
| Low Power Mode |
YES
|
|
| Number of DMA Channels |
|
|
| Number of I/O Lines |
101
|
101
|
| Number of Serial I/Os |
4
|
|
| Number of Terminals |
272
|
272
|
| Number of Timers |
3
|
|
| On Chip Data RAM Width |
8
|
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA272,20X20,50
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
26624
|
|
| ROM (words) |
458752
|
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
2.65 mm
|
2.65 mm
|
| Speed |
40 MHz
|
40 MHz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
HCMOS
|
HCMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
27 mm
|
27 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
6
|
4
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
272
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Terminal Finish |
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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