MPA17C256FNI
vs
XC17128ELPCG20I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
XILINX INC
Package Description
PLASTIC, LCC-20
QCCJ,
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
0.4 MHz
JESD-30 Code
S-PQCC-J20
S-PQCC-J20
Length
8.9662 mm
8.9662 mm
Memory Density
262144 bit
131072 bit
Memory IC Type
EEPROM
CONFIGURATION MEMORY
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
20
20
Number of Words
262144 words
131072 words
Number of Words Code
256000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX1
128KX1
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
4.572 mm
Serial Bus Type
I2C
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
8.9662 mm
8.9662 mm
Write Cycle Time-Max (tWC)
10 ms
Base Number Matches
1
1
Rohs Code
Part Package Code
QLCC
Pin Count
20
Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-609 Code
e3
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
40
Compare MPA17C256FNI with alternatives
Compare XC17128ELPCG20I with alternatives