MIC5841BWM
vs
UCQ5841A
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
ALLEGRO MICROSYSTEMS LLC
Part Package Code
SOIC
DIP
Package Description
SOIC-18
DIP,
Pin Count
18
18
Reach Compliance Code
unknown
compliant
Built-in Protections
TRANSIENT
TRANSIENT
Interface IC Type
SIPO BASED PERIPHERAL DRIVER
SIPO BASED PERIPHERAL DRIVER
JESD-30 Code
R-PDSO-G18
R-PDIP-T18
JESD-609 Code
e0
e0
Length
11.55 mm
22.86 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
18
18
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Current Flow Direction
SINK
SINK
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
240
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
2.65 mm
5.33 mm
Supply Voltage-Max
12 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
BICMOS
BIMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
7.5 mm
7.62 mm
Base Number Matches
3
1
Rohs Code
ECCN Code
EAR99
HTS Code
8542.39.00.01
Output Peak Current Limit-Nom
0.5 A
Package Equivalence Code
DIP18,.3
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