MCP6H72-E/MNY
vs
MCP6H72-E/SN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
HVSON,
SOP, SOP8,.25
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB)
0.025 µA
0.025 µA
Common-mode Reject Ratio-Nom
103 dB
103 dB
Input Offset Voltage-Max
4000 µV
4000 µV
JESD-30 Code
R-PDSO-N8
R-PDSO-G8
Length
3 mm
4.9 mm
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE
Screening Level
TS 16949
TS 16949
Seated Height-Max
0.8 mm
1.75 mm
Slew Rate-Nom
2 V/us
2 V/us
Supply Voltage Limit-Max
13.2 V
13.2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
2700
2700
Width
2 mm
3.9 mm
Base Number Matches
1
1
Rohs Code
Factory Lead Time
5 Weeks
Samacsys Manufacturer
Microchip
Architecture
VOLTAGE-FEEDBACK
Common-mode Reject Ratio-Min
80 dB
Frequency Compensation
YES
JESD-609 Code
e3
Low-Bias
YES
Low-Offset
NO
Micropower
YES
Moisture Sensitivity Level
3
Package Equivalence Code
SOP8,.25
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
Power
NO
Programmable Power
NO
Qualification Status
Not Qualified
Supply Current-Max
1.2 mA
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
40
Voltage Gain-Min
100000
Wideband
NO
Compare MCP6H72-E/MNY with alternatives
Compare MCP6H72-E/SN with alternatives