MCP6H72-E/MNY
vs
MAX4257ESA/V+T
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MAXIM INTEGRATED PRODUCTS INC
Package Description
HVSON,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB)
0.025 µA
0.00005 µA
Common-mode Reject Ratio-Nom
103 dB
115 dB
Input Offset Voltage-Max
4000 µV
750 µV
JESD-30 Code
R-PDSO-N8
S-PDSO-G8
Length
3 mm
3 mm
Number of Functions
2
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
TSSOP
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Screening Level
TS 16949
AEC-Q100
Seated Height-Max
0.8 mm
1.1 mm
Slew Rate-Nom
2 V/us
2.1 V/us
Supply Voltage Limit-Max
13.2 V
6 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
YES
YES
Technology
CMOS
BICMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
2700
22000
Width
2 mm
3 mm
Base Number Matches
1
2
Pbfree Code
Rohs Code
Part Package Code
SOIC
Pin Count
8
Architecture
VOLTAGE-FEEDBACK
Frequency Compensation
YES (AVCL>=10)
JESD-609 Code
e3
Low-Bias
YES
Low-Offset
YES
Micropower
YES
Moisture Sensitivity Level
1
Package Equivalence Code
SOP8,.25
Packing Method
TAPE AND REEL
Peak Reflow Temperature (Cel)
260
Power
NO
Programmable Power
NO
Qualification Status
Not Qualified
Supply Current-Max
1.15 mA
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
30
Voltage Gain-Min
10000
Wideband
NO
Compare MCP6H72-E/MNY with alternatives
Compare MAX4257ESA/V+T with alternatives