MCP2022-330E/ST
vs
MCP201-E/P
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
TSSOP
DIP
Package Description
HTSSOP,
DIP,
Pin Count
14
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G14
R-PDIP-T8
JESD-609 Code
e3
e3
Length
5 mm
9.271 mm
Number of Functions
1
1
Number of Terminals
14
8
Number of Transceivers
1
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
DIP
Package Equivalence Code
TSSOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Screening Level
TS 16949
Seated Height-Max
1.2 mm
5.334 mm
Supply Voltage-Nom
12 V
12 V
Surface Mount
YES
NO
Telecom IC Type
LIN TRANSCEIVER
INTERFACE CIRCUIT
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
7.62 mm
Base Number Matches
1
1
Pbfree Code
Samacsys Manufacturer
Microchip
Qualification Status
Not Qualified
Compare MCP2022-330E/ST with alternatives
Compare MCP201-E/P with alternatives