MCP2021T-330E/MDVAO
vs
BD41030FJ-CE2
feature comparison
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ROHM CO LTD
|
| Package Description |
DFN-8
|
LSOP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PDSO-N8
|
R-PDSO-G8
|
| Length |
4 mm
|
4.9 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
LSOP
|
| Package Equivalence Code |
SOLCC8,.16,32
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, LOW PROFILE
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Seated Height-Max |
1 mm
|
1.65 mm
|
| Supply Voltage-Nom |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
LIN TRANSCEIVER
|
INTERFACE CIRCUIT
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
4 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MCP2021T-330E/MDVAO with alternatives
Compare BD41030FJ-CE2 with alternatives