MCP2021T-330E/MDVAO
vs
MCP2021T-500E/MD
feature comparison
Part Life Cycle Code |
Not Recommended
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
DFN-8
|
4 X 4 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, DFN-8
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PDSO-N8
|
S-PDSO-N8
|
Length |
4 mm
|
4 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HVSON
|
Package Equivalence Code |
SOLCC8,.16,32
|
SOLCC8,.16,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Screening Level |
AEC-Q100
|
TS 16949
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Nom |
12 V
|
12 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
LIN TRANSCEIVER
|
LIN TRANSCEIVER
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
4 mm
|
4 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Part Package Code |
|
DFN
|
Pin Count |
|
8
|
ECCN Code |
|
EAR99
|
Samacsys Manufacturer |
|
Microchip
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Number of Transceivers |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare MCP2021T-330E/MDVAO with alternatives
Compare MCP2021T-500E/MD with alternatives