BD41030FJ-CE2
vs
MCP2021T-E/SN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ROHM CO LTD
MICROCHIP TECHNOLOGY INC
Package Description
LSOP,
3.90 MM, LEAD FREE, PLASTIC, SOIC-8
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
Length
4.9 mm
4.9 mm
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE
SMALL OUTLINE
Screening Level
AEC-Q100
Seated Height-Max
1.65 mm
1.75 mm
Supply Voltage-Nom
12 V
12 V
Surface Mount
YES
YES
Telecom IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
3.9 mm
Base Number Matches
1
1
Pbfree Code
Yes
Rohs Code
Yes
Part Package Code
SOIC
Pin Count
8
JESD-609 Code
e3
Moisture Sensitivity Level
1
Qualification Status
Not Qualified
Terminal Finish
MATTE TIN
Compare BD41030FJ-CE2 with alternatives
Compare MCP2021T-E/SN with alternatives