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MCM10144L vs N74S301F feature comparison

MCM10144L Motorola Semiconductor Products

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N74S301F NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 26 ns 50 ns
JESD-30 Code R-GDIP-T16 R-GDIP-T16
JESD-609 Code e0 e0
Length 19.3 mm
Memory Density 256 bit 256 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 16 16
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 75 °C
Operating Temperature-Min
Organization 256X1 256X1
Output Characteristics OPEN-EMITTER OPEN-COLLECTOR
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.19 mm
Supply Current-Max 0.13 mA
Surface Mount NO NO
Technology ECL TTL
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 3 3
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Memory » SRAMs
Memory » SRAMs

Compare MCM10144L with alternatives

Compare N74S301F with alternatives