MCM10144L
vs
N74301F
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
SIGNETICS CORP
Package Description
DIP, DIP16,.3
,
Reach Compliance Code
unknown
unknown
Access Time-Max
10 ns
50 ns
JESD-30 Code
R-XDIP-T16
R-GDIP-T16
JESD-609 Code
e0
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
1
Neg Supply Voltage-Nom
-5.2 V
Number of Terminals
16
16
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256X1
256X1
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Power Supplies
-5.2 V
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
0.13 mA
Surface Mount
NO
NO
Technology
ECL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
3
ECCN Code
EAR99
HTS Code
8542.32.00.41
Memory Density
256 bit
Number of Functions
1
Number of Ports
1
Output Characteristics
OPEN-COLLECTOR
Output Enable
NO
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
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