MCF5272CVM66
vs
MCF5271CVM100
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Not Recommended
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
PLASTIC, BGA-196
ROHS COMPLIANT, MAPBGA-196
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
5A002.A.1
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
4 Weeks
13 Weeks
Samacsys Manufacturer
NXP
NXP
Address Bus Width
23
24
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
75 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B196
S-PBGA-B196
JESD-609 Code
e1
e1
Length
15 mm
15 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
196
196
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.6 mm
Speed
66 MHz
100 MHz
Supply Voltage-Max
3.6 V
1.6 V
Supply Voltage-Min
3 V
1.4 V
Supply Voltage-Nom
3.3 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
40
Width
15 mm
15 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Compare MCF5272CVM66 with alternatives
Compare MCF5271CVM100 with alternatives