MCF5271CVM100 vs MCF5272VM66 feature comparison

MCF5271CVM100 Freescale Semiconductor

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MCF5272VM66 Freescale Semiconductor

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description ROHS COMPLIANT, MAPBGA-196 PLASTIC, BGA-196
Pin Count 196 196
Reach Compliance Code compliant compliant
ECCN Code 5A002.A 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP NXP
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 24 23
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 75 MHz 66 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B196 S-PBGA-B196
Length 15 mm 15 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 196 196
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA196,14X14,40 BGA196,14X14,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.75 mm
Speed 100 MHz 66 MHz
Supply Voltage-Max 1.6 V 3.6 V
Supply Voltage-Min 1.4 V 3 V
Supply Voltage-Nom 1.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER OVER NICKEL TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 15 mm 15 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
JESD-609 Code e1

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