MCF5271CVM100 vs MCF52277CVM160 feature comparison

MCF5271CVM100 Freescale Semiconductor

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MCF52277CVM160 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Not Recommended
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description ROHS COMPLIANT, MAPBGA-196 15 X 15 MM, ROHS COMPLIANT, MAPBGA-196
Pin Count 196
Reach Compliance Code compliant compliant
ECCN Code 5A002.A 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 24 24
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 75 MHz 66.67 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B196 S-PBGA-B196
Length 15 mm 15 mm
Low Power Mode YES NO
Moisture Sensitivity Level 3 3
Number of Terminals 196 196
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LFBGA
Package Equivalence Code BGA196,14X14,40 BGA196,14X14,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.7 mm
Speed 100 MHz 166.67 MHz
Supply Voltage-Max 1.6 V 1.6 V
Supply Voltage-Min 1.4 V 1.4 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER OVER NICKEL Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 15 mm 15 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Factory Lead Time 13 Weeks
JESD-609 Code e1
Supply Current-Max 0.7 mA

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