MCF5271CVM100
vs
GD80960JD-50
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
INTEL CORP
Part Package Code
BGA
BGA
Package Description
ROHS COMPLIANT, MAPBGA-196
PLASTIC, BGA-196
Pin Count
196
196
Reach Compliance Code
compliant
compliant
ECCN Code
5A002.A
HTS Code
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
BURST BUS
Address Bus Width
24
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
75 MHz
25 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B196
S-PBGA-B196
Length
15 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
196
196
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Equivalence Code
BGA196,14X14,40
BGA196(UNSPEC)
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
Speed
100 MHz
50 MHz
Supply Voltage-Max
1.6 V
3.45 V
Supply Voltage-Min
1.4 V
3.15 V
Supply Voltage-Nom
1.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER OVER NICKEL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
15 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
1
Power Supplies
3.3,3.3/5 V
Supply Current-Max
447 mA
Compare MCF5271CVM100 with alternatives
Compare GD80960JD-50 with alternatives