MC8610VT1333JZ
vs
PC8610MVT1066JB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
TELEDYNE E2V (UK) LTD
Part Package Code
BGA
BGA
Package Description
BGA,
BGA,
Pin Count
783
783
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
16
16
Bit Size
32
32
Boundary Scan
YES
YES
External Data Bus Width
64
64
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B783
S-PBGA-B783
Length
29 mm
Low Power Mode
YES
YES
Number of Terminals
783
783
Operating Temperature-Max
105 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.7 mm
Speed
1333 MHz
1066 MHz
Supply Voltage-Max
1.075 V
1.05 V
Supply Voltage-Min
0.975 V
0.95 V
Supply Voltage-Nom
1.025 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
MILITARY
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
29 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
1
ECCN Code
3A001.A.2.C
JESD-609 Code
e2
Terminal Finish
TIN SILVER
Compare MC8610VT1333JZ with alternatives
Compare PC8610MVT1066JB with alternatives