PC8610MVT1066JB
vs
MPC8560CVT833JC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TELEDYNE E2V (UK) LTD
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
BGA,
BGA,
Pin Count
783
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
16
Bit Size
32
Boundary Scan
YES
External Data Bus Width
64
Format
FIXED POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B783
JESD-609 Code
e2
Low Power Mode
YES
Number of Terminals
783
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Qualification Status
Not Qualified
Speed
1066 MHz
Supply Voltage-Max
1.05 V
Supply Voltage-Min
0.95 V
Supply Voltage-Nom
1 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN SILVER
Terminal Form
BALL
Terminal Position
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
Base Number Matches
1
2
Compare PC8610MVT1066JB with alternatives
Compare MPC8560CVT833JC with alternatives