MC75172BDWR2G
vs
HD26C31FP-EL
feature comparison
| Pbfree Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
RENESAS TECHNOLOGY CORP
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
LEAD FREE, PLASTIC, SOIC-20
|
SOP,
|
| Pin Count |
20
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| Differential Output |
YES
|
YES
|
| Driver Number of Bits |
4
|
4
|
| Input Characteristics |
STANDARD
|
STANDARD
|
| Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
| Interface Standard |
V.11; X.27; EIA-422-A; EIA-485
|
EIA-422-A
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G16
|
| JESD-609 Code |
e3
|
e0
|
| Length |
12.8 mm
|
10.06 mm
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
2.2 mm
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
| Transmit Delay-Max |
25 ns
|
11 ns
|
| Width |
7.5 mm
|
5.5 mm
|
| Base Number Matches |
1
|
3
|
| Rohs Code |
|
No
|
| Receive Delay-Max |
|
|
| Technology |
|
CMOS
|
|
|
|
Compare MC75172BDWR2G with alternatives
Compare HD26C31FP-EL with alternatives