MC74HC75N
vs
74HC75N,652
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Package Description
DIP,
0.300 INCH, PLASTIC, SOT-38-4, DIP-16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e0
e4
Length
19.175 mm
19.025 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D LATCH
D LATCH
Number of Bits
2
2
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
44 ns
190 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.44 mm
4.2 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Finish
TIN LEAD
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
HIGH LEVEL
HIGH LEVEL
Width
7.62 mm
7.62 mm
Base Number Matches
4
1
Part Package Code
DIP
Pin Count
16
Manufacturer Package Code
SOT38-4
Factory Lead Time
4 Weeks
Max I(ol)
0.004 A
Package Equivalence Code
DIP16,.3
Prop. Delay@Nom-Sup
36 ns
fmax-Min
60 MHz
Compare MC74HC75N with alternatives
Compare 74HC75N,652 with alternatives