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MC74HC75N vs M74HC75B1R feature comparison

MC74HC75N Motorola Semiconductor Products

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M74HC75B1R STMicroelectronics

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC STMICROELECTRONICS
Package Description DIP, DIP, DIP16,.3
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e0 e3
Length 19.175 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D LATCH D LATCH
Number of Bits 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 44 ns 190 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.44 mm 5.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type HIGH LEVEL HIGH LEVEL
Width 7.62 mm 7.62 mm
Base Number Matches 3 1
Part Package Code DIP
Pin Count 16
Max I(ol) 0.004 A
Package Equivalence Code DIP16,.3
Packing Method TUBE
Prop. Delay@Nom-Sup 33 ns
Logic » FF/Latches
Logic » FF/Latches

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