74HC75N,652 vs M74HC75B1R feature comparison

74HC75N,652 NXP Semiconductors

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M74HC75B1R STMicroelectronics

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS STMICROELECTRONICS
Part Package Code DIP DIP
Package Description 0.300 INCH, PLASTIC, SOT-38-4, DIP-16 DIP, DIP16,.3
Pin Count 16 16
Manufacturer Package Code SOT38-4
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e4 e3
Length 19.025 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D LATCH D LATCH
Max I(ol) 0.004 A 0.004 A
Number of Bits 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 36 ns 33 ns
Propagation Delay (tpd) 190 ns 190 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 5.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish NICKEL PALLADIUM GOLD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type HIGH LEVEL HIGH LEVEL
Width 7.62 mm 7.62 mm
fmax-Min 60 MHz
Base Number Matches 1 1
Packing Method TUBE

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