MC74HC75N
vs
CD74HC75EE4
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
TEXAS INSTRUMENTS INC
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Reach Compliance Code
unknown
compliant
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e0
e4
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D LATCH
D LATCH
Max I(ol)
0.004 A
0.004 A
Number of Bits
2
2
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
2/6 V
Prop. Delay@Nom-Sup
38 ns
33 ns
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
1
Pbfree Code
Part Package Code
DIP
Pin Count
16
HTS Code
8542.39.00.01
Family
HC/UH
Length
19.305 mm
Output Polarity
COMPLEMENTARY
Packing Method
TUBE
Propagation Delay (tpd)
195 ns
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
4.5 V
Trigger Type
HIGH LEVEL
Width
7.62 mm
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