MC7447AHX733NB
vs
PC7447VGU733LB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
ATMEL CORP
Part Package Code
BGA
BGA
Package Description
25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
BGA,
Pin Count
360
360
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 1.8V OR 2.5V SUPPLY
ALSO REQUIRES 1.8V OR 2.5V SUPPLY
Address Bus Width
36
36
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
167 MHz
167 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B360
S-CBGA-B360
JESD-609 Code
e0
Length
25 mm
25 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
1
Number of Terminals
360
360
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Equivalence Code
BGA360,19X19,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.24 mm
3.2 mm
Speed
733 MHz
733 MHz
Supply Voltage-Max
1.35 V
1.35 V
Supply Voltage-Min
1.25 V
1.25 V
Supply Voltage-Nom
1.3 V
1.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
2
Compare MC7447AHX733NB with alternatives
Compare PC7447VGU733LB with alternatives