PC7447VGU733LB
vs
PC7447AVGH1333LB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
ATMEL CORP
TELEDYNE E2V (UK) LTD
Part Package Code
BGA
BGA
Package Description
BGA,
BGA,
Pin Count
360
360
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 1.8V OR 2.5V SUPPLY
ALSO OPERATES AT 1.3V SUPPLY
Address Bus Width
36
36
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
167 MHz
167 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B360
S-CBGA-B360
Length
25 mm
25 mm
Low Power Mode
YES
YES
Number of Terminals
360
360
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.2 mm
3.2 mm
Speed
733 MHz
1333 MHz
Supply Voltage-Max
1.35 V
1.15 V
Supply Voltage-Min
1.25 V
1.05 V
Supply Voltage-Nom
1.3 V
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Compare PC7447VGU733LB with alternatives
Compare PC7447AVGH1333LB with alternatives